Multilayer PCBs
Controlled-impedance multilayer boards for compact and complex electronics.
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European manufacturing at Tööstuse 17, Paide
Since 1992 · Paide, Estonia
Multilayer, high-density and aluminium printed circuit boards for medical, industrial, power and advanced electronics.
PCB technologies
From engineering prototypes to repeat production, Brandner supports complex European programmes with disciplined process control and direct technical engagement.
Controlled-impedance multilayer boards for compact and complex electronics.
Explore →Fine-line structures, blind and buried vias, and precise layer registration.
Explore →Thermally managed metal-core boards for LED and power applications.
Explore →Robust current-carrying structures for industrial and power electronics.
Explore →Stack-up support and impedance control for signal-integrity requirements.
Explore →Responsive European manufacturing for development and qualification builds.
Explore →Why Brandner
Production, inspection and customer support from our Paide facility within the European Union.
ISO 9001:2015 quality management, electrical testing and lot-level manufacturing records.
Discuss stack-up, materials, tolerances, thermal requirements and production readiness with our team.
Applications
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Gerber or ODB++ data, fabrication drawing, quantities and required delivery date.